1. product pro?le 1.1 general description the IP4234CZ6 is designed to protect input/output (i/o) usb 2.0 ports, that are sensitive to capacitive loads, from being damaged by electrostatic discharge (esd). the p -?lter structure is implemented with a small series resistor to provide the necessary protection to signal and supply components from esd voltages greater than 8 kv contact discharge according iec 61000-4-2, level 4. the esd protection is independent of the supply voltage due to the rail-to-rail diode architecture being connected to a zener diode. the IP4234CZ6 is fabricated using monolithic silicon technology and integrates two ultra-low capacitance p -?lter esd protection diodes plus a zener diode in a miniature 6-lead sot457 package. 1.2 features n pb-free and rohs compliant n simple, direct signal routing provides for high speed signal integrity n esd protection compliant to iec 61000-4-2 level 4, 8 kv contact discharge n signi?cant reduction in peak clamping and peak residual current n four low input capacitance (2.0 pf typical) rail-to-rail esd protection diodes n low voltage clamping due to an integrated zener diode n small 6-lead so6 (sot457) package n iec 61000-4-5 15 a lightning (8/20 m s) compliant 1.3 applications n general-purpose downstream esd protection high frequency analog signals and high-speed serial data transmission for ports inside: u cellular and pcs mobile handsets u pc/notebook usb2.0/ieee1394 ports u dvi interfaces u hdmi interfaces u cordless telephones u wireless data (wan/lan) systems u pdas IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 rev. 01 16 april 2009 product data sheet
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 2 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 2. pinning information 3. ordering information 4. limiting values 5. recommended operating conditions table 1. pinning pin description simpli?ed outline graphic symbol 1 esd protection i/o channel 1 2 ground 3 esd protection i/o channel 1 4 esd protection i/o channel 2 5 supply voltage 6 esd protection i/o channel 2 13 2 4 5 6 3 rr 6 5 2 001aaj950 1 4 table 2. ordering information type number package name description version IP4234CZ6 tsop6 plastic surface-mounted package (tsop6); 6 leads sot457 table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage gnd - 0.5 +5.5 v v esd electrostatic discharge voltage all pins; iec 61000-4-2 level 4; contact discharge - 15 +15 kv p pp peak pulse power t p = 8/20 m s; iec 61000-4-5 15 a lightning - 100 w t stg storage temperature - 55 +125 c table 4. operating conditions symbol parameter conditions min max unit t amb ambient temperature - 40 +85 c
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 3 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 6. characteristics [1] guaranteed by design. 7. application information 7.1 universal serial bus 2.0 protection the IP4234CZ6 is optimized to protect a usb 2.0 port from esd. the device is capable of protecting both usb data lines and the v bus supply. a typical application is shown in figure 1 . to avoid a short circuit on the data lines when v bus is shut down, a back drive protection diode can be attached to the IP4234CZ6. table 5. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit c (i/o-gnd) input/output to ground capacitance pins 1, 3, 4, 6; v i = 0 v; f = 1 mhz; v cc = 3.0 v [1] - 2.5 - pf c (zd-gnd) zener diode to ground capacitance pin 5 to pin 2; v i = 0 v; f = 1 mhz; v cc = 3.0 v [1] -40-pf i lr reverse leakage current pins 1, 3, 4, 6 to ground; v i = 3.0 v - - 100 na v brzd zener diode breakdown voltage pin 5 to pin 2; i = 1 ma 6 - 9 v v f forward voltage [1] - 0.7 - v r s series resistance t case =25 c [1] - 0.5 - w fig 1. typical application of IP4234CZ6 r 654 123 r 001aaj951 v bus d - d+ gnd usb 2.0/ ieee1394 transceiver
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 4 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 8. package outline fig 2. package outline sot457 (tsop6) references outline version european projection issue date iec jedec jeita sot457 sc-74 wb m b p d e pin 1 index a a 1 l p q detail x h e e v m a a b y scale c x 13 2 4 5 6 0 1 2 mm plastic surface-mounted package (tsop6); 6 leads sot457 unit a 1 b p cd e h e l p qy w v mm 0.1 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 05-11-07 06-03-16
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 5 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 9. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 9.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 9.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 9.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 6 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 9.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 3 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 6 and 7 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 3 . table 6. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 7. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 7 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 10. abbreviations 11. revision history msl: moisture sensitivity level fig 3. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 8. abbreviations acronym description dvi digital video interface esd electrostatic discharge hdmi high de?nition multimedia interface lan local area network pcs personal computing system pda personal digital assistant rohs restriction of hazardous substances usb universal serial bus wan wide area network table 9. revision history document id release date data sheet status change notice supersedes IP4234CZ6_1 20090416 product data sheet - -
IP4234CZ6_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 16 april 2009 8 of 9 nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors IP4234CZ6 single usb 2.0 esd protection to iec 61000-4-2 level 4 ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 16 april 2009 document identifier: IP4234CZ6_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 recommended operating conditions. . . . . . . . 2 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 application information. . . . . . . . . . . . . . . . . . . 3 7.1 universal serial bus 2.0 protection . . . . . . . . . . 3 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 soldering of smd packages . . . . . . . . . . . . . . . 5 9.1 introduction to soldering . . . . . . . . . . . . . . . . . . 5 9.2 wave and re?ow soldering . . . . . . . . . . . . . . . . 5 9.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 5 9.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . . 6 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 contact information. . . . . . . . . . . . . . . . . . . . . . 8 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
|
